IEEE International Conference on Omni-layer Intelligent Systems 2025 – Extended deadline

IEEE International Conference on Omni-layer Intelligent Systems (COINS 2025) – Extended Deadline: April 22, 2025!

University of Wisconsin–Madison, USA – August 4–6, 2025
https://coinsconf.com

Important Dates:

• Paper Submission (Extended): April 22, 2025
• Special Sessions and Workshop Papers: April 8, 2025
• PhD Forum Submissions: May 13, 2025
• Acceptance Notification: May 31, 2025
• Camera-Ready Submission: June 21, 2025
• Special Session / Workshop / Tutorial Proposal Submission: March 31, 2025
• Industry Forum Proposal Submission: April 15, 2025

Are you interested in contributing to the future of the IoT and AI ecosystem?
Do you want to stay ahead of the curve and explore the latest digital technologies shaping our world?
Or are you simply curious about IoT, AI, and Big Data, and how they impact every aspect of our lives, society, and business?

IEEE COINS is the right place for you! IEEE COINS brings together researchers, engineers, practitioners, and thought leaders from across the globe to share their insights on cutting-edge developments in AI, IoT, security, low-power design, robotics, and more.

IEEE COINS offers a multidisciplinary program that includes technical research papers, industry panels, workshops, and tutorials. The conference aims to address all critical aspects of the AIoT (AI + IoT) ecosystem.

We invite submissions for original research papers and proposals in the following areas:

Topical Tracks:

1. Internet of Things: From Edge to Cloud
2. Sensing Devices and Systems for AIoT
3. Circuits and Systems (CAS) Designs for AIoT
4. Communications and Networking for AIoT
5. Artificial Intelligence, Machine Learning, and Cognitive Computing
6. Distributed Ledger Technologies and Blockchain
7. Low Power Design and Automation
8. Security and Privacy
9. Intelligent Robots and Systems
10. Embedded AI

Vertical Tracks:

1. Smart Infrastructure

• Smart Cities
• Energy and Smart Grids
• Smart Agriculture
• Smart Mobility, Transportation, and Logistics

1. Industry 4.0 and Smart Manufacturing
2. Digital Healthcare and Well-being

Special Tracks:

1. Emerging Technologies for Intelligent Systems
2. Generative AI: Systems, Architectures, and Applications

Panels:

1. Diversity, Equity, and Inclusion
2. Industry Talks and Insights
3. Workshops and Tutorials

Organizing Committee:

General Co-Chairs:

• Umit Yusuf Ogras, University of Wisconsin–Madison
• Amit Singh, University of Essex

Technical Program Co-Chairs:

• Fatemeh Afghah, Clemson University
• Priya Panda, Yale University

Publicity Co-Chairs:

• Aly Sabri Abdalla, Mississippi State University
• Nicola Dall’Ora, Guglielmo Marconi University & University of Verona, Italy
• Jaeha Kung, Korea University
• Sumit K. Mandal, IISc Bangalore
• Oktay Cetinkaya, University of Newcastle

For more information, paper templates, and submission guidelines, please visit:
https://coinsconf.com

We look forward to your contributions and hope to see you in Madison in August 2025!